How to Customize a PI Heating Element: Step-by-Step Guide
How to Customize a PI Heating Element: Step-by-Step Guide
Custom PI (Polyimide) heating elements are widely used in electronics, automotive, aerospace, medical equipment, and industrial temperature-control devices. Their ultra-thin, flexible, and high-precision characteristics make them an ideal choice for modern heating applications.
This guide explains the full customization process—design, materials, power configuration, etching, SMT mounting, testing, and mass production—so you can confidently develop a PI heating solution for your product.
1. Step 1 — Define Your Application Requirements
Every PI heater begins with a clear definition of usage conditions. This affects voltage, power density, circuit layout, and material selection.
Key parameters to provide:
- Application scenario: battery heating, medical device, sensor, camera, EV, aerospace, etc.
- Target temperature: e.g., 40–80°C
- Working environment: humidity, pressure, chemical exposure, vibration
- Power source: DC / AC, voltage range (3.7V / 5V / 12V / 24V…)
- Space limitations: thickness, width, shape of install area
2. Step 2 — Provide Size, Shape & Layout
PI heaters can be made in almost any geometry:
- Rectangular
- Round
- Annular
- 3D Curved Shapes
- Custom CNC-cut patterns
If your design has holes, slots, or irregular edges, these can also be etched precisely.
Tip: Provide a 2D CAD file (DXF/AI/STEP) for the fastest accuracy.
3. Step 3 — Determine Voltage, Power & Resistance
The core electrical design of a PI heater comes from Ohm’s law:
P = V² / R
You choose based on your needs:
- Low-voltage (3.7V–12V) → drones, wearables, consumer electronics
- Medium-voltage (12V–24V) → automotive, sensors
- High-voltage (48V–220V) → industrial equipment
Engineers will calculate the track width, spacing, and foil thickness to meet your desired watt density.
4. Step 4 — Choose Materials: PI Film, Adhesive & Foil
Typical structure:
- Polyimide film thickness: 12.5μm / 25μm
- Copper foil: 12μm / 18μm
- Adhesive: high-temp acrylic or epoxy
- Reinforcement layers: fiberglass, aluminum foil (for heat spreading)
Tip: Use thicker PI or FR film for >80°C applications.
5. Step 5 — Etched Foil Circuit Design
PI heaters use chemical etching to form extremely fine heating circuits.
Advantages of etched foil:
- Very uniform heat distribution
- Ultra-thin (<0.3 mm)
- Bendable and flexible
- High precision—track width can be 0.2–0.5mm
6. Step 6 — Add SMT Thermistors, Thermocouples, or Sensors
Modern PI heaters often integrate sensing components:
Options:
- SMT NTC thermistor
- PTC thermistor
- Digital temperature sensor (e.g. DS18B20)
- K-type thermocouple
These sensors allow precise temperature feedback to a controller.
New Technology: Some manufacturers support full SMT process on PI heaters, including connectors and control ICs.
7. Step 7 — Select Connector & Terminal Type
Common choices:
- Golden Finger (best for reliability)
- JST / Molex connectors
- Solder Pads
- FPC Connectors
Gold-finger interfaces improve durability and conductivity, especially for high-cycle applications.
8. Step 8 — Prototype, Testing & Certification
Before mass production, you will receive samples to test:
- Resistance measurement
- Temperature uniformity
- Power stability
- Aging test
- Insulation & dielectric strength
Products may meet:
- ISO9001
- IPC-2223
- KC / CE / UL standards
9. Step 9 — Mass Production & Delivery
Once the prototype is approved, production begins:
- PI sheet cutting
- Circuit etching
- Lamination
- SMT assembly
- Final testing
- Packing & shipping
Large-scale output ensures consistency for OEM customers.
Conclusion
Customizing a PI heating element requires expert engineering and precise manufacturing. From power design to sensor integration, each step influences performance and reliability. With advanced technologies such as etched foil circuits, SMT thermistors, gold-finger connectors, and strict quality control, modern PI heaters deliver superior temperature control for high-tech industries.