Our R&D Capabilities: Patents, Technology, and Engineering Strength

As demand for lightweight, efficient, and high-performance heating systems grows in the EV, medical, telecom, aerospace, and smart device industries, the importance of a strong R&D foundation becomes essential. Our company has built a complete engineering and research system specializing in polyimide (PI) heating films, flexible heating circuits, thermal management, intelligent temperature control, and custom heating modules.

This page provides a deep dive into our patents, engineering capabilities, material research, simulation technology, testing systems, and production-level innovation.

1. Patented Heating Technologies

We continuously invest in innovation to enhance heating efficiency, temperature uniformity, and reliability. Our patents cover multiple aspects of flexible heating technology.

Key patented technologies include:

Fine-line etched circuit technology for ultra-thin PI heaters
Multi-zone temperature control structure for precision heating
Embedded SMT thermistor integration for stable feedback control
Modular heater architecture for EV batteries and telecom devices
Flexible heater reinforcement structure improving mechanical durability
Ultra-thin bonding method to reduce lamination thickness

We continue filing new patents annually to maintain a technological edge in flexible heating materials and circuit engineering.

2. Advanced Material Science Capabilities

High-performance PI heating films rely on precise material engineering. Our R&D team works closely with PI film suppliers, copper foil producers, and adhesive manufacturers to optimize long-term reliability and thermal performance.

Material research includes:

High-temperature polyimide film (up to 200–260°C)
Adhesive systems including acrylic, epoxy, and silicone-resistant glue
Ultra-thin copper foil (12–35 μm) for fine-line circuits
High-performance adhesives such as 3M 468MP, 3M 9448A
High-insulation lamination structures
Material behavior testing under extreme cold or high humidity

Our lab continuously analyzes material changes through thermal aging, moisture resistance, dielectric strength, and peel force testing.

3. Precision Circuit Design & Thermal Simulation

We use industry-leading engineering software to design and simulate heating circuits, ensuring uniform heat distribution and optimized resistance control.

Design capabilities:

Ultra-fine circuit design (minimum line width 0.3–0.5 mm)
Complex multi-zone heating structures
Intelligent sensor integration (NTC/PTC/RTD/thermal fuses)
Fast-turn prototype design (1–3 days)
Custom connector and interface design

Our simulation tools allow engineers to review heat flow, thermal gradients, current density, and potential weak spots before production.

4. Structural Engineering & Product Integration

Beyond electrical design, our structural engineers ensure PI heaters integrate seamlessly into customer devices.

We optimize:

Heater thickness & mechanical tolerance
Bonding conditions for plastic, metal, and composite surfaces
Waterproof & dustproof sealing (IP54–IP67)
Anti-vibration reinforcement for drones & automotive systems
Connector routing and flex durability

This ensures heaters meet the real-world needs of EV batteries, medical devices, robotics, 3D printers, and telecom equipment.

5. In-House Testing & Reliability Validation

A complete set of reliability equipment ensures every new design meets international quality standards.

Testing capabilities include:

Resistance tolerance measurement (±5%, ±3%, ±1%)
Temperature uniformity scan with IR camera
High-voltage insulation test up to 1500–3000V
Thermal aging test (8–48 hours)
Peel force test for adhesion strength
Humidity & temperature cycling (−40°C to 120°C)
Current overload and short-circuit simulation

These tests ensure stability and reliability across thousands of production batches.

6. Engineering Team & Research Culture

Our engineering team includes experts from electrical engineering, material science, thermal design, and SMT processing.

Team highlights:

10+ senior electrical engineers
Material science specialists focusing on PI and adhesives
Dedicated 3D/CAD team for customer projects
SMT engineers for thermistor placement and bonding
DFM engineers for manufacturing optimization

With strong collaboration across teams, we can provide fast prototyping, high customization, and long-term technical support.

7. Continuous Process Innovation

Process innovation is essential to producing reliable and high-performance PI heating films. We invest in advanced machines and tooling upgrades yearly.

Innovations include:

Automated optical alignment for fine-line etching
High-precision lamination under controlled pressure
Improved copper etching process for uniformity
Automated SMT for micro thermistors
Energy-efficient drying and curing processes
Tight SPC control for stable mass production

These innovations result in better temperature uniformity, longer service life, and higher product yield.

8. Custom Development for Industry Applications

Our R&D team has deep experience in developing industry-specific heating modules.

Industries we support:

EV battery thermal management
Telecom base station dehumidification
Aerospace lightweight heating films
Medical device warming modules
Industrial sensor heating pads
3D printer bed and nozzle heating films
Consumer electronics
Robotics and drone battery heating

Each industry has specific reliability and safety requirements, and our engineering team customizes the heater design accordingly.

Conclusion

Our R&D capabilities form the foundation of our ability to deliver high-performance, cost-effective, and customized PI heating solutions to global customers. From patents and materials research to thermal simulation, SMT integration, and rigorous testing, our engineering system ensures reliability and performance in every project.

FAQ

1. Can your team help design heating circuits from scratch?

Yes. Our engineers can provide full design services including resistance, circuit layout, connectors, and thermal analysis.

2. Do you support custom materials or multi-layer structures?

Yes. We support custom PI thickness, copper weight, multi-zone designs, thermistor options, and adhesive types.

3. What testing can you provide for new projects?

We offer resistance testing, thermal uniformity scans, aging tests, insulation tests, and environmental reliability tests.